Microchip Launches BZPACK mSiC® Power Modules for Critical Applications in Harsh Environments

Microchip Technology has announced its new BZPACK mSiC® power modules, developed for high-demand applications operating in harsh environments. This launch reinforces the company’s advancement in silicon carbide (SiC)-based solutions, a technology that is becoming increasingly strategic for power conversion systems requiring high efficiency, robustness, and long-term reliability.

The new modules were designed to meet stringent operating requirements under extreme conditions, including compliance with HV-H3TRB (High Humidity, High Voltage, High Temperature Reverse Bias) standards, one of the most demanding tests used to validate the durability of electronic components exposed to humidity, high voltage, and elevated temperatures.

Reliability for Industrial and Energy Applications

The BZPACK mSiC modules enter the market with a clear focus on high performance and superior resistance for industrial and renewable energy applications, where reliability is critical. According to Microchip, the devices have been tested to meet HV-H3TRB standards beyond the traditional 1,000-hour benchmark, increasing confidence in long-term deployments.

This level of ruggedness is especially important in systems exposed to severe conditions, such as industrial inverters, power converters, renewable energy infrastructure, and other critical applications where thermal control, electrical insulation, and operational stability are essential.

Topology Flexibility and Easier Integration

The new BZPACK family is available in several topologies, including:

• half-bridge

• full-bridge

• three-phase

• PIM/CIB configurations

This variety gives designers and integrators greater flexibility to optimize performance, cost, and system architecture according to the needs of each application.

Another important differentiator is the module design itself. With a compact, baseplate-less structure, the modules help simplify manufacturing and reduce system complexity. The family also features solderless Press-Fit terminals and the option of pre-applied Thermal Interface Material (TIM), enabling faster assembly, improved production consistency, and easier multisourcing through industry-standard footprints.

In addition, the modules were designed to be pin-compatible, making integration into different projects and platforms easier.

Enhanced Thermal Performance and Electrical Insulation

The BZPACK mSiC modules leverage Microchip’s advanced mSiC technology, incorporating the performance of its MB and MC SiC MOSFET families.

Among the main technical highlights are:

• CTI 600V package, contributing to improved insulation performance

• Stable Rds(on) across different temperature ranges

• substrate options in Aluminum Oxide (Al₂O₃) or Aluminum Nitride (AlN), supporting better thermal management and durability

These features make the modules better suited to handle high power density, intense thermal cycling, and continuous operation in critical environments.

MB and MC Families Expand Application Possibilities

Microchip also highlights its MB and MC mSiC MOSFET families, which support both industrial and automotive applications, including options qualified under the AEC-Q101 standard.

These devices support common gate-source voltages (VGS ≥ 15V) and are supplied in industry-standard packages, making them easier to integrate into new designs.

Within the MC family, one of the key advantages is the integration of a gate resistor, which provides better switching control, low switching energy, and greater stability in multi-die configurations. These solutions are currently available in TO-247-4 Notch and die (waffle pack) formats.

SiC Technology for More Efficient and Durable Projects

With more than 20 years of experience in the development, design, manufacturing, and support of silicon carbide-based devices, Microchip continues to strengthen its portfolio with solutions that help customers accelerate time-to-market, reduce total system cost, and minimize design risk.

The launch of the BZPACK mSiC modules reinforces the evolution of the power electronics market, where SiC-based technologies are becoming increasingly important for applications that demand energy efficiency, field reliability, and high thermal performance.

Grupo Autcomp Is Ready to Support Your Demand

For companies seeking solutions in power electronics, industrial automation, and high-performance applications, Grupo Autcomp is ready to support the development and implementation of projects using advanced technologies such as Microchip’s new BZPACK mSiC modules.

With experience serving the industrial sector and a strong focus on innovation, Grupo Autcomp is prepared to provide both technical and commercial support, helping customers choose the most suitable solution for each application, always with a focus on performance, reliability, and competitiveness.

Contact Grupo Autcomp to learn more about this technology and understand how it can add value to your project.